1. 2. 3. material content data sheet sales product name tle4976-2k issued 28. august 2013 ma# MA000505228 package pg-sc59-3-4 weight* 13.88 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 0.705 5.08 5.08 50755 50755 leadframe inorganic material silicon 7440-21-3 0.001 0.01 76 non noble metal titanium 7440-32-6 0.005 0.04 378 non noble metal chromium 7440-47-3 0.016 0.11 1134 non noble metal copper 7440-50-8 5.224 37.63 37.79 376322 377910 wire noble metal gold 7440-57-5 0.011 0.08 0.08 825 825 encapsulation organic material carbon black 1333-86-4 0.056 0.40 4032 plastics brominated resin - 0.070 0.50 5039 inorganic material antimonytrioxide 1309-64-4 0.140 1.01 10079 plastics epoxy resin - 1.273 9.17 91718 inorganic material silicondioxide 60676-86-0 5.457 39.31 50.39 393076 503944 leadfinish non noble metal tin 7440-31-5 0.240 1.73 1.73 17277 17277 plating noble metal silver 7440-22-4 0.363 2.62 2.62 26177 26177 glue plastics epoxy resin - 0.056 0.40 4045 noble metal silver 7440-22-4 0.265 1.91 2.31 19067 23112 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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